STMicroelectronics has introduced a car satellite navigation chip designed to provide high-quality location data required by advanced driving systems.
Joining ST’s Teseo V series, the STA8135GA automotive-grade GNSS receiver integrates a tri-frequency positioning measurement engine. It also provides standard multi-band position-speed-time (PVT) and dead reckoning.
The STA8135GA’s tri-band enables the receiver to effectively capture and track the largest number of satellites in multiple constellations at the same time, thereby providing excellent performance under difficult conditions (such as urban canyons and under tree cover).
Tri-frequency has historically been used in professional applications such as measurement, surveying and precision agriculture. These applications require millimeter accuracy and have minimal reliance on calibration data. They can usually be used in larger and more expensive modules than ST’s single-chip STA8135GA.
The compact STA8135GA will help the driver assistance system make accurate decisions on the road ahead. The multi-constellation receiver provides raw information for the host system to run any precise positioning algorithm, such as PPP/RTK (precise point positioning/real-time kinematics). The receiver can track satellites in the GPS, GLONASS, Beidou, Galileo, QZSS and NAVIC/IRNSS constellations.
STA8135GA also integrates an independent low-dropout regulator on the chip to supply power for the analog circuit, digital core, and input/output transceiver, simplifying the choice of external power supplies.
STA8135GA also enhances the performance of dashboard navigation systems, telematics equipment, smart antennas, V2X communication systems, marine navigation systems, unmanned aerial vehicles and other vehicles.
“The high precision and single-chip integration provided by the STA8135GA satellite receiver support the creation of a reliable and affordable navigation system that makes the vehicle safer and more aware of the environment,” said Luca Celant, general manager of the ADAS, ASIC and audio divisions, STMicroelectronics Automotive and Discrete Devices Division. “Our unique internal design resources and processes for high-volume manufacturing are one of the key capabilities that make this industry’s first equipment possible.”
STA8135GA adopts 7 x 11 x 1.2 BGA package. The samples are now on the market, fully complying with AEC-Q100 requirements and planned to start production in the first quarter of 2022.
Post time: Dec-11-2021